Areas of application

Backed by a 200 mm MEMS production line at CEA-Leti in Grenoble, the CSEM-MEMS facilities in Neuchâtel, a pilot line for organic devices and a MOEMS-production line at Fraunhofer IPMS in Dresden, and a packaging line at Fraunhofer IZM in Berlin, MEMS sensor and RF MEMS processes on 150 mm wafers at VTT, the HTA represents a comprehensive technology platform. It can develop and produce all types of MEMS devices, including those using CMOS ICs as a backplane. But it can also integrate all these heterogeneous technologies into a single package or even a single chip. The combination of the technological infrastructure of all four institutions enables the HTA to act as a one stop-shop for complete system solutions.